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 HD74LS242
Quadruple Bus Transceivers (with three-state outputs)
REJ03D0461-0300 Rev.3.00 Jul.15.2005
Features
* Ordering Information
Part Name HD74LS242P HD74LS242FPEL Package Type DILP-14 pin SOP-14 pin (JEITA) Package Code (Previous Code) PRDP0014AB-B (DP-14AV) PRSP0014DF-B (FP-14DAV) Package Abbreviation P FP Taping Abbreviation (Quantity) -- EL (2,000 pcs/reel)
Note: Please consult the sales office for the above package availability.
Pin Arrangement
GAB NC 1A 2A 3A 4A GND
1 2 3 4 5 6 7
14 13 12 11 10 9 8
VCC GBA NC 1B 2B 3B 4B
(Top view)
Function Table
Control input Data port status GAB GBA A B H H Inverting output Input L H * H L Isolated Isolated L L Input Inverting output Notes: 1. H; high level, L; low level 2. *; Possibly destructive oscillation may occur if the transceivers are enabled in both directions at once.
Rev.3.00, Jul.15.2005, page 1 of 6
HD74LS242
Block Diagram
GAB Transceiver (1/4)
A
B
GBA
Absolute Maximum Ratings
Item Supply voltage Input voltage Power dissipation Storage temperature GAB, GBA A, B Symbol VCC VIN VIN PT Tstg Ratings 7 7 5.5 400 -65 to +150 Unit V V V mW C
Note: Voltage value, unless otherwise noted, are with respect to network ground terminal.
Recommended Operating Conditions
Item Supply voltage Output current Operating temperature Symbol VCC IOH IOL Topr Min 4.75 -- -- -20 Typ 5.00 -- -- 25 Max 5.25 -15 24 75 Unit V mA mA C
Rev.3.00, Jul.15.2005, page 2 of 6
HD74LS242
Electrical Characteristics
(Ta = -20 to +75 C)
Item Input voltage Hysteresis Symbol VIH VIL VT+ - VT- VOH Output voltage VOL Off-state output current IOZH IOZL IIH min. 2.0 -- 0.2 2.4 2 -- -- -- -- -- -- IIL -- -- -- -- -40 -- -- -- -- typ.* -- -- 0.4 -- -- -- -- -- -- -- -- -- -- -- -- -- 22 29 29 -- max. -- 0.8 -- -- -- 0.4 0.5 40 -200 20 -0.2 -0.2 -0.2 0.1 0.1 -225 38 50 50 -1.5 mA Unit V V V V V A A Condition
VCC = 4.75 V VIL = 0.8 V, IOH = - 3 mA VCC = 4.75 V, VIH = 2 V VIL = 0.5 V, IOH = - 15 mA IOL = 12 mA VCC = 4.75 V, VIH = 2 V, VIL = 0.8 V IOL = 24 mA VO = 2.7 V VCC = 5.25 V, VIH = 2 V, VIL = 0.8 V VO = 0.4 V VCC = 5.25 V, VI = 2.7 V VCC = 5.25 V, VI = 0.4 V, GAB or GBA at GND VCC = 5.25 V, VI = 0.4 V, GAB or GBA at 4.5 V VCC = 5.25 V, VI = 0.4 V VCC = 5.25 V, VI = 5.5 V VCC = 5.25 V, VI = 7 V VCC = 5.25 V
A Input Input current B Input GAB or GBA A or B GAB or GBA Short-circuit output current Supply current**
II IOS ICCH ICCL
mA mA
mA
VCC = 5.25 V
ICCZ Input clamp voltage VIK V VCC = 4.75 V, IIN = -18 mA Notes: * VCC = 5 V, Ta = 25C ** With all outputs open, ICC is measured with transceivers enabled in one direction only, or with all transceivers disabled.
Switching Characteristics
(VCC = 5 V, Ta = 25C)
Item Propagation delay time Output enable time Output disable time Symbol tPLH tPHL tZL tZH tLZ tHZ min. -- -- -- -- -- -- typ. 9 12 20 15 15 10 max. 14 18 30 23 25 18 Unit Condition
CL = 45 pF, RL = 667 ns CL = 5 pF, RL = 667
Rev.3.00, Jul.15.2005, page 3 of 6
HD74LS242
Testing Method
Test Circuit
4.5 V VCC GAB Output RL S1
See function table
Input P.G. Zout = 50
1B 1A
S3
CL GBA
5 k
S2
Notes:
1. 2. 3. 4.
2A-2B, 3A-3B, 4A-4B are identical to abobe load circuit. CL includes probe and jig capacitance. S3 is a input-output switch. All diodes are 1S2074(H).
Waveforms 1
tTLH Input A (or B) 90 % 1.3 V tPHL tPLH Output B (or A) 1.3 V 1.3 V VOL tTHL 90 % 1.3 V 3V 10 % 0V VOH
10 %
Note:
Input pulse: tTLH 15 ns, tTHL 6 ns, PRR = 1 MHz, duty cycle 50%
Rev.3.00, Jul.15.2005, page 4 of 6
HD74LS242 Waveforms 2
tTHL GAB 90 % 1.3 V 3V 10 % 0V 3V GBA 1.3 V tZL Waveform-a S1 close S2 open tZH Waveform-b S1 open S2 close 1.3 V ~ ~0V 1.3 V VOL VOH tHZ 0V ~ ~ 4.5 V tLZ S1, S2 close 0.5 V VOL VOH 0.5 V ~ ~ 1.5 V S1, S2 close 1.3 V 0V ~ 1.5 V ~ 10 % tTLH 90 % 1.3 V 0V 3V 3V
Notes:
1. Input pulse: tTLH 15 ns, tTHL 6 ns, PRR = 1 MHz, duty cycle 50% 2. Waveform a is an output by internal conditions like "L" except for the case where an output is disabled by output control. 3. Waveform b is an output by internal conditions like "H" except for the case where an output is disabled by output control.
Rev.3.00, Jul.15.2005, page 5 of 6
HD74LS242
Package Dimensions
JEITA Package Code P-DIP14-6.3x19.2-2.54 RENESAS Code PRDP0014AB-B Previous Code DP-14AV MASS[Typ.] 0.97g
D
14
8
1 b3
7
Z
E
Reference Symbol
Dimension in Millimeters Min Nom 7.62 19.2 6.3 20.32 7.4 5.06 0.51 0.40 0.48 1.30 0.19 0 2.29 2.54 0.25 0.31 15 2.79 2.39 2.54 0.56 Max
A
A1
e1 D E
L
A A1 bp
e
bp
e1
c
b3 c
e Z
( Ni/Pd/Au plating )
L
JEITA Package Code P-SOP14-5.5x10.06-1.27
RENESAS Code PRSP0014DF-B
Previous Code FP-14DAV
MASS[Typ.] 0.23g
*1
D 8
F
NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET.
14
bp
HE
E
Index mark
*2
c
Reference Symbol
Dimension in Millimeters Min Nom 10.06 5.50 Max 10.5
Terminal cross section ( Ni/Pd/Au plating )
1 Z e
*3
D E A2 A1 0.00
7 bp x M L1
0.10
0.20 2.20
A bp b1 c c
1
0.34
0.40
0.46
0.15
0.20
0.25
A
HE
0 7.50 7.80 1.27
8 8.00
A1
y L
e x y
0.12 0.15 1.42 0.50
1
Detail F
Z L L 0.70 1.15
0.90
Rev.3.00, Jul.15.2005, page 6 of 6
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd. Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> 2-796-3115, Fax: <82> 2-796-2145
http://www.renesas.com
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(c) 2005. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .3.0


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